Difference: ElectricalPrototypeHybridSeven (1 vs. 13)

Revision 132017-05-25 - TomErikHaugen

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META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 49 to 49
  ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf
Changed:
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These scans show no low gain channels, however the "wonky gain" still appears on chip #3 (indexed from 0). Talking with Craig about this it appears that there is a voltage drop in the hybrid for the connection of that specific chip.
>
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Going back to the wafer data we see a clear correlationa and similar sloping of gain.

Hybrid_7_Wafer_Gain_1.png

This hybrid was placed on the first electrical module on May 5th 2017.

  -- Tom-Erik Haugen - 2016-12-05
Line: 68 to 72
 
META FILEATTACHMENT attachment="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170302_101445.pdf" attr="" comment="" date="1488479657" name="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170302_101445.pdf" path="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170302_101445.pdf" size="563942" user="TomErikHaugen" version="1"
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META FILEATTACHMENT attachment="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf" attr="" comment="" date="1491603478" name="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf" path="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf" size="567190" user="TomErikHaugen" version="1"
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META FILEATTACHMENT attachment="Hybrid_7_Wafer_Gain_1.png" attr="" comment="" date="1495731138" name="Hybrid_7_Wafer_Gain_1.png" path="Hybrid_7_Wafer_Gain (1).png" size="17410" user="TomErikHaugen" version="1"

Revision 122017-04-07 - TomErikHaugen

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META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 35 to 35
  Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently Chip ID is more stable with 2 of these bonds. Removed padterm bond on chip 18. Tests run concurrently with tests for HybridOne on March 2nd.
Changed:
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Results from QC for hybrid are included below:
>
>
Initial Results from QC for hybrid are included below:
  Strobe Delay: ABC130_Panel_I_Hybrid7_HCC14_StrobeDelayPlot_20170302_100649.pdf
Line: 45 to 45
  Hybrid 7 was moved to TM panel for storage on March 9th, 2017.
Added:
>
>
Results show multiple low gain and high offset channels, the hybrid was moved back onto the panel on __ for further testing. There is a further voltage drop in the panel itself, so to get 1.5 Volts on the hybrid the power supply needs to be run at 1.65 Volts. The further 3 Point Gain scan is included below:

ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf

These scans show no low gain channels, however the "wonky gain" still appears on chip #3 (indexed from 0). Talking with Craig about this it appears that there is a voltage drop in the hybrid for the connection of that specific chip.

 -- Tom-Erik Haugen - 2016-12-05

Comments

Line: 61 to 67
 
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Added:
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META FILEATTACHMENT attachment="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf" attr="" comment="" date="1491603478" name="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf" path="ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170322_154707_1.pdf" size="567190" user="TomErikHaugen" version="1"

Revision 112017-04-03 - TomErikHaugen

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META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 23 to 23
  Hybrid_Seven.jpg
Changed:
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HCC chip 10-5 glued on hybrid 7 on Dec 5th
>
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HCC chip 10-5 glued on hybrid 7 on Dec 5th. Rhonda mounted the chip by hand, placing it with plastic ESD tweezers and silver epoxy. Hybrid panel was placed in oven to reduce cure time for epoxy.
 

Wire Bonding

Revision 102017-03-09 - TomErikHaugen

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META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 43 to 43
  Noise Occupancy: ABC130_Panel_I_Hybrid7_HCC14_NoScurve_20170302_102044.pdf ABC130_Panel_I_Hybrid7_HCC14_ABC130NoPlot_20170302_102044.pdf
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Hybrid 7 was moved to TM panel for storage on March 9th, 2017.
 -- Tom-Erik Haugen - 2016-12-05

Comments

Revision 92017-03-02 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 33 to 33
 

DAQ and Connection

Changed:
<
<
Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently Chip ID is more stable with 2 of these bonds. Removed padterm bond on chip 18 on hybrid 7.
>
>
Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently Chip ID is more stable with 2 of these bonds. Removed padterm bond on chip 18. Tests run concurrently with tests for HybridOne on March 2nd.

Results from QC for hybrid are included below:

Strobe Delay: ABC130_Panel_I_Hybrid7_HCC14_StrobeDelayPlot_20170302_100649.pdf

3 Point Gain: ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170302_101445.pdf

Noise Occupancy: ABC130_Panel_I_Hybrid7_HCC14_NoScurve_20170302_102044.pdf ABC130_Panel_I_Hybrid7_HCC14_ABC130NoPlot_20170302_102044.pdf

  -- Tom-Erik Haugen - 2016-12-05
Line: 46 to 54
 
META FILEATTACHMENT attachment="Chips_on_Jig.jpg" attr="" comment="" date="1480961938" name="Chips_on_Jig.jpg" path="Chips_on_Jig.jpg" size="2990303" user="TomErikHaugen" version="1"
META FILEATTACHMENT attachment="Glued_Chips.jpg" attr="" comment="" date="1480961938" name="Glued_Chips.jpg" path="Glued_Chips.jpg" size="2929772" user="TomErikHaugen" version="1"
META FILEATTACHMENT attachment="Hybrid_Seven.jpg" attr="" comment="" date="1480961938" name="Hybrid_Seven.jpg" path="Hybrid_Seven.jpg" size="4166612" user="TomErikHaugen" version="1"
Added:
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META FILEATTACHMENT attachment="Hybrid_Panel_Config.tar.gz" attr="" comment="" date="1488479590" name="Hybrid_Panel_Config.tar.gz" path="Hybrid_Panel_Config.tar.gz" size="2754" user="TomErikHaugen" version="1"
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META FILEATTACHMENT attachment="ABC130_Panel_I_Hybrid7_HCC14_StrobeDelayPlot_20170302_100649.pdf" attr="" comment="" date="1488479657" name="ABC130_Panel_I_Hybrid7_HCC14_StrobeDelayPlot_20170302_100649.pdf" path="ABC130_Panel_I_Hybrid7_HCC14_StrobeDelayPlot_20170302_100649.pdf" size="471493" user="TomErikHaugen" version="1"

Revision 82017-02-16 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 33 to 33
 

DAQ and Connection

Changed:
<
<
Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently ChipID is more stable with 2 of these bonds.
>
>
Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently Chip ID is more stable with 2 of these bonds. Removed padterm bond on chip 18 on hybrid 7.
  -- Tom-Erik Haugen - 2016-12-05

Revision 72017-02-16 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 27 to 27
 

Wire Bonding

Changed:
<
<
Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (see simplistic diagram). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.
>
>
Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (up towards data side, back from sensor side). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.
  Power bonds were outside of bond area, wrote program on hybrid 6 then moved it over to hybrid 7. Able to get bonds down, however had to redo multiple that did not stick.
Added:
>
>

DAQ and Connection

Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently ChipID is more stable with 2 of these bonds.

 -- Tom-Erik Haugen - 2016-12-05

Comments

Revision 62017-01-17 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 27 to 27
 

Wire Bonding

Changed:
<
<
Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be
>
>
Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (see simplistic diagram). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.

Power bonds were outside of bond area, wrote program on hybrid 6 then moved it over to hybrid 7. Able to get bonds down, however had to redo multiple that did not stick.

  -- Tom-Erik Haugen - 2016-12-05

Revision 52016-12-10 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 11 to 11
  The resistor arrays were fixed on Dec 1st by John Joseph.
Changed:
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<
The chips were glued to the hybrid on Dec 2nd. The chips used were ABC 130 A0 chips from lot AIQ819H, chips 85-105. This is shown in the following image.
>
>
The chips were glued to the hybrid on Dec 2nd. The chips used were ABC 130 A0 chips from lot AIQ819H, chips 85-105. The wafer test results for this batch are on this page https://twiki.cern.ch/twiki/bin/view/Atlas/ABC130WaferTest. This is shown in the following image.
  Chip_Numbers.png

Revision 42016-12-08 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 25 to 25
  HCC chip 10-5 glued on hybrid 7 on Dec 5th
Added:
>
>

Wire Bonding

Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be

 -- Tom-Erik Haugen - 2016-12-05

Comments

Revision 32016-12-06 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Added:
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This is the seventh hybrid from the first electrical hybrid panel.
 

Construction

Hybrid Seven was the first electrical hybrid glued. It had the fewest problems (only needed C7-C12 fixed and RP1 and RP2 orientation fixed).

Revision 22016-12-05 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Line: 22 to 22
  Hybrid_Seven.jpg
Added:
>
>
HCC chip 10-5 glued on hybrid 7 on Dec 5th
 -- Tom-Erik Haugen - 2016-12-05

Comments

Revision 12016-12-05 - TomErikHaugen

Line: 1 to 1
Added:
>
>
META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

Construction

Hybrid Seven was the first electrical hybrid glued. It had the fewest problems (only needed C7-C12 fixed and RP1 and RP2 orientation fixed).

The capacitors were fixed on Nov 30th by John Joseph.

The resistor arrays were fixed on Dec 1st by John Joseph.

The chips were glued to the hybrid on Dec 2nd. The chips used were ABC 130 A0 chips from lot AIQ819H, chips 85-105. This is shown in the following image.

Chip_Numbers.png

The silver epoxy glue was successfuly spread over the chips.

Glued_Chips.jpg

The glued chips were left over the weekend to dry.

Hybrid_Seven.jpg

-- Tom-Erik Haugen - 2016-12-05

Comments


<--/commentPlugin-->

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