Difference: ElectricalPrototypeHybridSeven (5 vs. 6)

Revision 62017-01-17 - TomErikHaugen

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META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

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Wire Bonding

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Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be
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Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (see simplistic diagram). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.

Power bonds were outside of bond area, wrote program on hybrid 6 then moved it over to hybrid 7. Able to get bonds down, however had to redo multiple that did not stick.

  -- Tom-Erik Haugen - 2016-12-05
 
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