Difference: ElectricalPrototypeHybridSeven (6 vs. 7)

Revision 72017-02-16 - TomErikHaugen

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META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

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Wire Bonding

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Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (see simplistic diagram). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.
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Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (up towards data side, back from sensor side). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.
  Power bonds were outside of bond area, wrote program on hybrid 6 then moved it over to hybrid 7. Able to get bonds down, however had to redo multiple that did not stick.
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DAQ and Connection

Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently ChipID is more stable with 2 of these bonds.

 -- Tom-Erik Haugen - 2016-12-05

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