Difference: ElectricalPrototypeHybridSeven (12 vs. 13)

Revision 132017-05-25 - TomErikHaugen

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META TOPICPARENT name="FirstElectricalHybridPanel"

Hybrid Seven (First Electrical Hybrid Panel)

This is the seventh hybrid from the first electrical hybrid panel.


Hybrid Seven was the first electrical hybrid glued. It had the fewest problems (only needed C7-C12 fixed and RP1 and RP2 orientation fixed).

The capacitors were fixed on Nov 30th by John Joseph.

The resistor arrays were fixed on Dec 1st by John Joseph.

The chips were glued to the hybrid on Dec 2nd. The chips used were ABC 130 A0 chips from lot AIQ819H, chips 85-105. The wafer test results for this batch are on this page https://twiki.cern.ch/twiki/bin/view/Atlas/ABC130WaferTest. This is shown in the following image.


The silver epoxy glue was successfuly spread over the chips.


The glued chips were left over the weekend to dry.


HCC chip 10-5 glued on hybrid 7 on Dec 5th. Rhonda mounted the chip by hand, placing it with plastic ESD tweezers and silver epoxy. Hybrid panel was placed in oven to reduce cure time for epoxy.

Wire Bonding

Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (up towards data side, back from sensor side). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.

Power bonds were outside of bond area, wrote program on hybrid 6 then moved it over to hybrid 7. Able to get bonds down, however had to redo multiple that did not stick.

DAQ and Connection

Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently Chip ID is more stable with 2 of these bonds. Removed padterm bond on chip 18. Tests run concurrently with tests for HybridOne on March 2nd.

Initial Results from QC for hybrid are included below:

Strobe Delay: ABC130_Panel_I_Hybrid7_HCC14_StrobeDelayPlot_20170302_100649.pdf

3 Point Gain: ABC130_Panel_I_Hybrid7_HCC14_RCPlot_20170302_101445.pdf

Noise Occupancy: ABC130_Panel_I_Hybrid7_HCC14_NoScurve_20170302_102044.pdf ABC130_Panel_I_Hybrid7_HCC14_ABC130NoPlot_20170302_102044.pdf

Hybrid 7 was moved to TM panel for storage on March 9th, 2017.

Results show multiple low gain and high offset channels, the hybrid was moved back onto the panel on __ for further testing. There is a further voltage drop in the panel itself, so to get 1.5 Volts on the hybrid the power supply needs to be run at 1.65 Volts. The further 3 Point Gain scan is included below:


These scans show no low gain channels, however the "wonky gain" still appears on chip #3 (indexed from 0). Talking with Craig about this it appears that there is a voltage drop in the hybrid for the connection of that specific chip.
Going back to the wafer data we see a clear correlationa and similar sloping of gain.


This hybrid was placed on the first electrical module on May 5th 2017.

  -- Tom-Erik Haugen - 2016-12-05



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