Difference: FirstElectricalModule (7 vs. 8)

Revision 82018-02-01 - CharilouLabitan

Line: 1 to 1
META TOPICPARENT name="ElectricalPrototypeHybridSeven"

First Electrical Module (ABC130)

This module was constructed with hybrid one and hybrid seven.


Hybrid seven was mounted on May 4th. On May 8th we attempted to mount hybrid one, however we saw that chip 3 had come loose. That chip was replaced, bonded, tested, and then the hybrid was mounted onto the module.

Hybrid seven was bonded to the module on May 10th. While bonding hybrid one on May 12th we found all of the chips on the HCC side were loose. The bonder broke the small amount of glue connection on chips 0-5 (chip 3 had already been replaced).

Metrology was performed using the SmartScope on both hybrids on the sensor. Using 2 points on the corners of the chips and one point on the hybrid between each chip. Fitting the hybrid heights with a polynomial and subtracting that fit from the chip heights we see the following measurements (this was when only one chip had been replaced):


The goal for the glue heights is 80 microns. Each glue dot is originally made at 120 microns then squeezed down to 80. This shows hybrid seven was glued well, but that hybrid 1 had some absolute slope that caused the chips on one side to not be pressed down enough. Therefore there was only a small amount of glue contact and that broke over time in handling the hybrid.

Chips 0-5 were all replaced (again chip 3 had been replaced before mounting the hybrid). The chips were bonded to the hybrid and the hybrid was bonded to the test frame. This was so that we could test the hybrid before and after bonding to the module.

Retesting Hybrid 1

The first attempts to connect resulted in not being able to capture the HCC ID. After debugging some we found (with the help of Karol) that the data lines were inverted relative to the DAQload, resulting in the binary signal being inverted. This is shown in the image below


After flipping the wire bonds we were able to run all of the tests and get results.

If you keep the wire bonds as written in Liverpool's wire bonding diagram, you can use variable 53 in ITSDAQ to do the data inversion.

[e->ConfigureVariable(X, 53, Y)] where X is the module number from the configuration file (first number in the system config line) and Y = 0/1 (0 for normal, and 1 for invert. *This was implemented in ATLYS a116 or later and NEXYS b118 or later.


HV Biasing

The original plan was to follow the wire bond diagram for module construction. After talking with Craig it became clear that we should vary the plan some. To correctly connect the HV we had to do the following steps:

  • Solder a wire on the test frame to short HVret and LV GND
  • Connect the four corners with AC connections, then connect one of the inner corners of the hybrid to the bias ring to route the leakage current into the HCC
  • Not connect the HVret on the hybrid to the frame, as R2 creates a lot of noise for the system.
Module_Data_Bonds.jpg Module_Power_Bonds.jpg


Power Board

Rhonda glued the power board by hand with 24hr Epolite 5313A epoxy and fishing wire. When the power board was first placed, there wasn't enough glue. It was then picked up by the shield box, and glue was added to the bottom of the power board. To hold it in place, a foam and plexiglass piece was improvised, and a weight was put on top of it. In hindsight, we should have used the usual brass weight instead of the one pictured. When gluing the power board, we had to be careful not to get glue on the guard ring, as that is known to cause early break down of the sensor.


Adding extra glue to the power board.


Foam and plexiglass piece created to hold down power board.


Gluing power board with weight. (Next time, should use brass weight.)


Checking for glue on the guard ring.

-- Charilou Labitan - 2018-01-24

Completed EL-01.

-- Charilou Labitan - 2018-02-01




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