Difference: TestingTmModules (1 vs. 2)

Revision 22017-06-26 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="ThermoMechanical"

Testing TM Modules

Changed:
<
<
<!-- Image of TM module in frame -->
>
>
TM_Module_In_Frame.jpg
 
Changed:
<
<
The thermomechanical modules are largely passive components. Each hybrids has 2 resistors (0.68 Ohm) to dissipate heat where the HCC would be. The total resistance of the hybrid between the powering pads should be ~3.8 Ohms. The powerboard drops the voltage from the stave voltage to the hybrid voltage, measures the temperature, and acts as a DVM.
>
>
The thermomechanical modules are largely passive components. Each hybrids has 2 resistors (0.68 Ohm) to dissipate heat where the HCC would be. The total resistance of the hybrid between the powering pads should be ~3.8 Ohms. The powerboard drops the voltage from the stave voltage to the hybrid voltage, measures the temperature, and acts as a DVM.
 

Wire Bonding

The module is placed in the test frame (same test frames used for electrical modules). The powerboard is bonded to the test frame and to the hybrids shown in the diagram below.

Changed:
<
<
<!-- Diagram of bonding TM PB -->
>
>
tm_powerboard_bond-diagram.png
 

Testing TM Modules

The testing is done with an Arduino circuit with a voltage shifter. The Powerboard communicates with 1-Wire with the Arduino. It takes a number between 0-255 which sets the voltage the hybrids see. It then outputs a temperature reading and a PTAT reading.

Line: 21 to 20
 

Comments


<--/commentPlugin-->
\ No newline at end of file
Added:
>
>
META FILEATTACHMENT attachment="TM_Module_In_Frame.jpg" attr="" comment="" date="1498497833" name="TM_Module_In_Frame.jpg" path="TM_Module_In_Frame.jpg" size="4783532" user="TomErikHaugen" version="1"
META FILEATTACHMENT attachment="tm_powerboard_bond-diagram.png" attr="" comment="" date="1498497851" name="tm_powerboard_bond-diagram.png" path="tm_powerboard_bond-diagram.png" size="3896745" user="TomErikHaugen" version="1"

Revision 12017-06-15 - TomErikHaugen

Line: 1 to 1
Added:
>
>
META TOPICPARENT name="ThermoMechanical"

Testing TM Modules

<!-- Image of TM module in frame -->

The thermomechanical modules are largely passive components. Each hybrids has 2 resistors (0.68 Ohm) to dissipate heat where the HCC would be. The total resistance of the hybrid between the powering pads should be ~3.8 Ohms. The powerboard drops the voltage from the stave voltage to the hybrid voltage, measures the temperature, and acts as a DVM.

Wire Bonding

The module is placed in the test frame (same test frames used for electrical modules). The powerboard is bonded to the test frame and to the hybrids shown in the diagram below.

<!-- Diagram of bonding TM PB -->

Testing TM Modules

The testing is done with an Arduino circuit with a voltage shifter. The Powerboard communicates with 1-Wire with the Arduino. It takes a number between 0-255 which sets the voltage the hybrids see. It then outputs a temperature reading and a PTAT reading.

-- Tom-Erik Haugen - 2017-06-15

Comments


<--/commentPlugin-->
 
This site is powered by the TWiki collaboration platform Powered by PerlCopyright © 2008-2019 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.
Ideas, requests, problems regarding TWiki? Send feedback