Difference: ThermoMechanical (1 vs. 6)

Revision 62017-07-21 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="GlueDocumentation"

Thermomechanical modules (TM)

Line: 18 to 18
  The Hybrids come on a hybrid panel, for the TM modules there are version 1.1 and 1.2 hybrids (1.2 are wider where the HCC is).
Changed:
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<
Note: Most pictures are from the first electrical module as this was when I was actually taking pictures. In principle the assembly is the same.
>
>
Note: Most pictures are from the first electrical module as this was when I was actually taking pictures. In principle the assembly is the same.
  IMG_20170405_163228140_HDR.jpg
Line: 65 to 65
  The powerboard is placed between the hybrids. There are multiple different methods used. I will briefly go over them. In short the glue is spread on the sensor, spacers are put between the board and the sensor, the board is placed on the glue, then weighed down over night.
Added:
>
>
powerboards.jpg
 Glue Spreading:

The glue is spread by hand by the technician, we used the epolite epoxy with a cure time of 24 hours. There are multple concerns with the glue. There needs to be enough that the bond pads are stable and do not bounce, and there needs to be enough under the coil that it makes good thermal contact with the sensor. There should not be so much that it leaks over and glue seeps onto the top of the hybrids or the bond pads.

Changed:
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<!-- Image of the glue line spread -->
>
>
Glue_Trial.jpg
  Spacers:
Line: 77 to 79
  1. As Brookhaven suggested we placed kapton tape on the bottom of the powerboards. One piece on each and and one in the middle. This was not trivial to do as we needed to cut and handle small pieces of kapton and place them without damaging the board much. This was done for 9 of the powerboards.
Changed:
<
<
<!-- Image of kapton under the powerboard -->

2. As Santa Cruz suggested we used fishing line. We cut short pieces and placed in the glue. This seemed to set the height as well and was very easy to do. There is some uncertainty on the thickness of the fishing line.

>
>
2. As Santa Cruz suggested we used fishing line. We cut short pieces and placed in the glue. This seemed to set the height as well and was very easy to do. There is some uncertainty on the thickness of the fishing line.
 
Changed:
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<!-- Image of fising line in glue -->
>
>
Glue.jpg
  Board Placement:

The board was placed by hand on the sensor. The bond pads for power need to line up between the powerboard and the hybrids, and the power pads at the end of the board need to be close enought that they can be bonded to the test frame.

Changed:
<
<
<!-- Image of PB placement -->

It is important to note that the guard ring on the sensor is sensitive and should not get glue on it. This will effect the electrical characteristics of the sensor and should be avoided. As such some of the TM modules had the powerboard shifter further back to avoid touching the guard ring at all.

>
>
It is important to note that the guard ring on the sensor is sensitive and should not get glue on it. This will effect the electrical characteristics of the sensor and should be avoided. As such some of the TM modules had the powerboard shifter further back to avoid touching the guard ring at all.
  Weighing down:

The tooling produced at BNL applies pressure to the chips in the center of the PB. The powerboard arcs up so pushing in the middle will flatten it out. The individual legs can be adjusted to change the height of this tooling.

Changed:
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<!-- Image of BNL tooling -->

We also produced a small piece of tooling that pushes in the center and presses the powerboards to the sensor. This allowed multple gluings to happen at once.

>
>
We also produced a small piece of tooling that pushes in the center and presses the powerboards to the sensor. This allowed multple gluings to happen at once.
 
Changed:
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<
<!-- Image of our tooling -->
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>
PB_Tooling_Top.jpg PB_Tooling_Side.jpg PB_Tooling_Support.jpg
 
Changed:
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-- Tom-Erik Haugen - 2016-11-29
>
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-- Tom-Erik Haugen - 2016-11-29
 

Comments

Line: 118 to 114
 
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Added:
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Revision 52017-07-21 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="GlueDocumentation"

Thermomechanical modules (TM)

Line: 10 to 10
  There are two kinds of glue used. Silver epoxy (Loctite Ablestik 2902) is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy (Epolite 5313A) is in the strips cabinet.
Deleted:
<
<
<!-- image of both epoxies -->
 The epoxy is two liquids, mix the well inside the plastic container then pour out the mixture onto a piece of plastic in the epoxy mixing station. Take the glue spreader and replace the tape on the end. Use this to spread the glue.
Deleted:
<
<
<!-- Image of glue spreader -->
 The epoxy solidifies over time after it is mixed. Use it within ~15 minutes of mixing it, however allow it ~24 hours to dry. Important note: it will start to solidify once mixed, whether or not it is exposed to air, meaning if it is mixed but still in the plastic tube it came in it will still solidify.

Gluing the hybrid

The Hybrids come on a hybrid panel, for the TM modules there are version 1.1 and 1.2 hybrids (1.2 are wider where the HCC is).

Changed:
<
<
<!-- Image of Panel -->

This panel is screwed onto a base plate. Clean the hybrid you plan to glue with ethanol and a Q-tip, and connect the vacuum to the hybrid you plan to glue.

>
>
Note: Most pictures are from the first electrical module as this was when I was actually taking pictures. In principle the assembly is the same.
 
Changed:
<
<
<!-- Image of panel base plate -->
>
>
IMG_20170405_163228140_HDR.jpg
 
Changed:
<
<
The chips (for TM modules they are glass) are placed one at a time using the vacuum pen in the positioning base plate.
>
>
This panel is screwed onto a base plate. Clean the hybrid you plan to glue with ethanol and a Q-tip, and connect the vacuum to the hybrid you plan to glue.
 
Changed:
<
<
<!-- image of positioning base plate with directions drawn on -->
>
>
The chips (for TM modules they are glass) are placed one at a time using the vacuum pen in the positioning base plate. The unpatterned chips are much smaller than the patterned chips and the real chips, and need to be aligned carefully in the base plate.
 
Changed:
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Chip_Placement.jpg
>
>
Chip_Placement.jpg
  Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. Part A of the jigs is missing the metal support so it is not usable. Part A fits on the positioning base plate so it should be used for chips to hybrid. Part B works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.
Deleted:
<
<
<!-- Image of the vacuum jigs including the identifying marks that will be added to this documentation -->
 Connect the appropriate vacuum jig to the vacuum but do not turn on the vacuum yet. Place the vacuum jig on the positioning base plate with the rotating legs down so that it stands above the chips. Carefully check the alignment and slowly lower the vacuum jig so that it comes down parallel to the plate. Lower until it is all the way down, the four bumps on the jig should be touching the base plate. Turn on the vacuum.
Deleted:
<
<
<!-- Image of vacuum jig standing above the positioning base plate -->
 Slowly lift up the vacuum jig and check the alignment of the chips. Lower the glue plate on the jig (the plate with 5 holes for each chip) slowly and evenly.
Changed:
<
<
<!-- image of glue plate on jig -->

Glued_Chips.jpg

>
>
IMG_20161220_145548216.jpg
  Now get the silver epoxy and the glue spreader. Get a dab of epoxy on the tip of the spreader and spread it on the glue plate. Do not press down very hard or else it will spread out on the chips to much.
Changed:
<
<
Now slowly lower the jig on the hybrid panel (again lining up 'T' over 'T'). Lower it evenly and once it is all the way down place the weight on top of the jig and let it solidify for 24 hours.
>
>
Glued_Chips.jpg
 
Changed:
<
<
<!-- Image of weight on jig -->
>
>
Now slowly lower the jig on the hybrid panel (again lining up 'T' over 'T'). Lower it evenly and once it is all the way down place the weight on top of the jig and let it solidify for 24 hours.
 
Added:
>
>
IMAG0315.jpg
 

Gluing the Module

Take the base plate for the sensor plate and place the sensor on it (on top of the piece of paper to spread the suction). The strips should be running parallel to the metal supports along the sides. Line the sensor up so the it is touching both of the metal pins, then turn on the vacuum.

Changed:
<
<
<!-- image of sensor on base plate -->
>
>
IMG_20170504_072735019_HDR.jpg
 
Changed:
<
<
Check that the jig can be lowered down all the way on this base plate (again line up 'T' over 'T'). Now with the vacuum to the hybrid panel turned on cut the connectors from the hybrid to the panel.
>
>
Check that the jig can be lowered down all the way on this base plate (again line up 'T' over 'T'). Now with the vacuum to the hybrid panel turned on cut the connectors from the hybrid to the panel.
 
Changed:
<
<
<!-- Image of connectors from hybrid to panel -->
>
>
hybrid_Connectors.png
 
Changed:
<
<
Lower the jig on the hybrid panel, turn off the vacuum to the hybrid and turn on the vacuum to the jig. Now slowly lift up the hybrid and lower the hybrid glue plate onto the jig.
>
>
Lower the jig on the hybrid panel, turn off the vacuum to the hybrid and turn on the vacuum to the jig. Now slowly lift up the hybrid and lower the hybrid glue plate onto the jig.
 
Changed:
<
<
<!-- Image of hybrid glue plate on jig -->
>
>
IMG_20161220_145628528.jpg
 
Changed:
<
<
Spread the regular epoxy on this glue plate, again do not push too hard or else it will seep out along the edges. Now with the epoxy on the hybrid slowly lower it down onto the sensor plate and place the weight on top of the jig. Again wait 24 hours for the glue to harden.
>
>
Spread the regular epoxy on this glue plate, again do not push too hard or else it will seep out along the edges. Now with the epoxy on the hybrid slowly lower it down onto the sensor plate and place the weight on top of the jig. Again wait 24 hours for the glue to harden.
 
Changed:
<
<

Powerboard Placement

>
>
IMG_20170504_074128970.jpg
 
Changed:
<
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<!-- Image of Powerboard -->
>
>

Powerboard Placement

 
Changed:
<
<
The powerboard is placed between the hybrids. There are multiple different methods used. I will briefly go over them. In short the glue is spread on the sensor, spacers are put between the board and the sensor, the board is placed on the glue, then weighed down over night.
>
>
The powerboard is placed between the hybrids. There are multiple different methods used. I will briefly go over them. In short the glue is spread on the sensor, spacers are put between the board and the sensor, the board is placed on the glue, then weighed down over night.
  Glue Spreading:
Line: 122 to 111
 
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Added:
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Revision 42017-06-15 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="GlueDocumentation"

Thermomechanical modules (TM)

Added:
>
>
The wirebonding and testing of TM modules is described here and the shipping to Brookhaven is described here.
 Important rule for this entire process: Most of the pieces are marked with a 'T', this is for alignment. Always place the equipment so that 'T' is over 'T'.

Mixing the glue

There are two kinds of glue used. Silver epoxy (Loctite Ablestik 2902) is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy (Epolite 5313A) is in the strips cabinet.

Changed:
<
<
<-- image of both epoxies -->
>
>
<!-- image of both epoxies -->
  The epoxy is two liquids, mix the well inside the plastic container then pour out the mixture onto a piece of plastic in the epoxy mixing station. Take the glue spreader and replace the tape on the end. Use this to spread the glue.
Changed:
<
<
<-- Image of glue spreader -->
>
>
<!-- Image of glue spreader -->
  The epoxy solidifies over time after it is mixed. Use it within ~15 minutes of mixing it, however allow it ~24 hours to dry. Important note: it will start to solidify once mixed, whether or not it is exposed to air, meaning if it is mixed but still in the plastic tube it came in it will still solidify.
Line: 20 to 22
  The Hybrids come on a hybrid panel, for the TM modules there are version 1.1 and 1.2 hybrids (1.2 are wider where the HCC is).
Changed:
<
<
<-- Image of Panel -->
>
>
<!-- Image of Panel -->
  This panel is screwed onto a base plate. Clean the hybrid you plan to glue with ethanol and a Q-tip, and connect the vacuum to the hybrid you plan to glue.
Changed:
<
<
<-- Image of panel base plate -->
>
>
<!-- Image of panel base plate -->
  The chips (for TM modules they are glass) are placed one at a time using the vacuum pen in the positioning base plate.
Changed:
<
<
<-- image of positioning base plate with directions drawn on -->
>
>
<!-- image of positioning base plate with directions drawn on -->
  Chip_Placement.jpg
Changed:
<
<
Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. Part A of the jigs is missing the metal support so it is not usable. Part A fits on the positioning base plate so it should be used for chips to hybrid. Part B works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.
>
>
Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. Part A of the jigs is missing the metal support so it is not usable. Part A fits on the positioning base plate so it should be used for chips to hybrid. Part B works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.
 
Changed:
<
<
<-- Image of the vacuum jigs including the identifying marks that will be added to this documentation -->
>
>
<!-- Image of the vacuum jigs including the identifying marks that will be added to this documentation -->
  Connect the appropriate vacuum jig to the vacuum but do not turn on the vacuum yet. Place the vacuum jig on the positioning base plate with the rotating legs down so that it stands above the chips. Carefully check the alignment and slowly lower the vacuum jig so that it comes down parallel to the plate. Lower until it is all the way down, the four bumps on the jig should be touching the base plate. Turn on the vacuum.
Changed:
<
<
<-- Image of vacuum jig standing above the positioning base plate -->
>
>
<!-- Image of vacuum jig standing above the positioning base plate -->
  Slowly lift up the vacuum jig and check the alignment of the chips. Lower the glue plate on the jig (the plate with 5 holes for each chip) slowly and evenly.
Changed:
<
<
<-- image of glue plate on jig -->
>
>
<!-- image of glue plate on jig -->
  Glued_Chips.jpg
Line: 50 to 52
  Now slowly lower the jig on the hybrid panel (again lining up 'T' over 'T'). Lower it evenly and once it is all the way down place the weight on top of the jig and let it solidify for 24 hours.
Changed:
<
<
<-- Image of weight on jig -->
>
>
<!-- Image of weight on jig -->
 

Gluing the Module

Take the base plate for the sensor plate and place the sensor on it (on top of the piece of paper to spread the suction). The strips should be running parallel to the metal supports along the sides. Line the sensor up so the it is touching both of the metal pins, then turn on the vacuum.

Changed:
<
<
<-- image of sensor on base plate -->
>
>
<!-- image of sensor on base plate -->
  Check that the jig can be lowered down all the way on this base plate (again line up 'T' over 'T'). Now with the vacuum to the hybrid panel turned on cut the connectors from the hybrid to the panel.
Changed:
<
<
<-- Image of connectors from hybrid to panel -->
>
>
<!-- Image of connectors from hybrid to panel -->
  Lower the jig on the hybrid panel, turn off the vacuum to the hybrid and turn on the vacuum to the jig. Now slowly lift up the hybrid and lower the hybrid glue plate onto the jig.
Changed:
<
<
<-- Image of hybrid glue plate on jig -->
>
>
<!-- Image of hybrid glue plate on jig -->
  Spread the regular epoxy on this glue plate, again do not push too hard or else it will seep out along the edges. Now with the epoxy on the hybrid slowly lower it down onto the sensor plate and place the weight on top of the jig. Again wait 24 hours for the glue to harden.
Added:
>
>

Powerboard Placement

<!-- Image of Powerboard -->

The powerboard is placed between the hybrids. There are multiple different methods used. I will briefly go over them. In short the glue is spread on the sensor, spacers are put between the board and the sensor, the board is placed on the glue, then weighed down over night.

Glue Spreading:

The glue is spread by hand by the technician, we used the epolite epoxy with a cure time of 24 hours. There are multple concerns with the glue. There needs to be enough that the bond pads are stable and do not bounce, and there needs to be enough under the coil that it makes good thermal contact with the sensor. There should not be so much that it leaks over and glue seeps onto the top of the hybrids or the bond pads.

<!-- Image of the glue line spread -->

Spacers:

There are 2 methods that we used for spacers:

1. As Brookhaven suggested we placed kapton tape on the bottom of the powerboards. One piece on each and and one in the middle. This was not trivial to do as we needed to cut and handle small pieces of kapton and place them without damaging the board much. This was done for 9 of the powerboards.

<!-- Image of kapton under the powerboard -->

2. As Santa Cruz suggested we used fishing line. We cut short pieces and placed in the glue. This seemed to set the height as well and was very easy to do. There is some uncertainty on the thickness of the fishing line.

<!-- Image of fising line in glue -->

Board Placement:

The board was placed by hand on the sensor. The bond pads for power need to line up between the powerboard and the hybrids, and the power pads at the end of the board need to be close enought that they can be bonded to the test frame.

<!-- Image of PB placement -->

It is important to note that the guard ring on the sensor is sensitive and should not get glue on it. This will effect the electrical characteristics of the sensor and should be avoided. As such some of the TM modules had the powerboard shifter further back to avoid touching the guard ring at all.

Weighing down:

The tooling produced at BNL applies pressure to the chips in the center of the PB. The powerboard arcs up so pushing in the middle will flatten it out. The individual legs can be adjusted to change the height of this tooling.

<!-- Image of BNL tooling -->

We also produced a small piece of tooling that pushes in the center and presses the powerboards to the sensor. This allowed multple gluings to happen at once.

<!-- Image of our tooling -->

 -- Tom-Erik Haugen - 2016-11-29

Comments

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<--/commentPlugin-->
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<--/commentPlugin-->
 
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Revision 32017-04-10 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="GlueDocumentation"

Thermomechanical modules (TM)

Line: 4 to 4
  Important rule for this entire process: Most of the pieces are marked with a 'T', this is for alignment. Always place the equipment so that 'T' is over 'T'.
Deleted:
<
<
 

Mixing the glue

Changed:
<
<
There are two kinds of glue used. Silver epoxy is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy is in the strips cabinet.
>
>
There are two kinds of glue used. Silver epoxy (Loctite Ablestik 2902) is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy (Epolite 5313A) is in the strips cabinet.
 
<-- image of both epoxies -->
Line: 32 to 30
 
<-- image of positioning base plate with directions drawn on -->
Changed:
<
<
Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. One of the jigs is missing the metal support so it is not usable. One fits on the positioning base plate so it should be used for chips to hybrid. One works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.
>
>
Chip_Placement.jpg

Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. Part A of the jigs is missing the metal support so it is not usable. Part A fits on the positioning base plate so it should be used for chips to hybrid. Part B works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.

 
<-- Image of the vacuum jigs including the identifying marks that will be added to this documentation -->
Line: 44 to 44
 
<-- image of glue plate on jig -->
Added:
>
>
Glued_Chips.jpg
 Now get the silver epoxy and the glue spreader. Get a dab of epoxy on the tip of the spreader and spread it on the glue plate. Do not press down very hard or else it will spread out on the chips to much.

Now slowly lower the jig on the hybrid panel (again lining up 'T' over 'T'). Lower it evenly and once it is all the way down place the weight on top of the jig and let it solidify for 24 hours.

Line: 72 to 73
 

Comments

<--/commentPlugin-->
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>
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Revision 22016-11-29 - TomErikHaugen

Line: 1 to 1
 
META TOPICPARENT name="GlueDocumentation"

Thermomechanical modules (TM)

Added:
>
>
Important rule for this entire process: Most of the pieces are marked with a 'T', this is for alignment. Always place the equipment so that 'T' is over 'T'.

Mixing the glue

There are two kinds of glue used. Silver epoxy is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy is in the strips cabinet.

<-- image of both epoxies -->

The epoxy is two liquids, mix the well inside the plastic container then pour out the mixture onto a piece of plastic in the epoxy mixing station. Take the glue spreader and replace the tape on the end. Use this to spread the glue.

<-- Image of glue spreader -->

The epoxy solidifies over time after it is mixed. Use it within ~15 minutes of mixing it, however allow it ~24 hours to dry. Important note: it will start to solidify once mixed, whether or not it is exposed to air, meaning if it is mixed but still in the plastic tube it came in it will still solidify.

Gluing the hybrid

 The Hybrids come on a hybrid panel, for the TM modules there are version 1.1 and 1.2 hybrids (1.2 are wider where the HCC is).
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<-- Image of Panel -->
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This panel is screwed onto a base plate
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This panel is screwed onto a base plate. Clean the hybrid you plan to glue with ethanol and a Q-tip, and connect the vacuum to the hybrid you plan to glue.

<-- Image of panel base plate -->

The chips (for TM modules they are glass) are placed one at a time using the vacuum pen in the positioning base plate.

<-- image of positioning base plate with directions drawn on -->

Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. One of the jigs is missing the metal support so it is not usable. One fits on the positioning base plate so it should be used for chips to hybrid. One works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.

<-- Image of the vacuum jigs including the identifying marks that will be added to this documentation -->

Connect the appropriate vacuum jig to the vacuum but do not turn on the vacuum yet. Place the vacuum jig on the positioning base plate with the rotating legs down so that it stands above the chips. Carefully check the alignment and slowly lower the vacuum jig so that it comes down parallel to the plate. Lower until it is all the way down, the four bumps on the jig should be touching the base plate. Turn on the vacuum.

<-- Image of vacuum jig standing above the positioning base plate -->

Slowly lift up the vacuum jig and check the alignment of the chips. Lower the glue plate on the jig (the plate with 5 holes for each chip) slowly and evenly.

<-- image of glue plate on jig -->

Now get the silver epoxy and the glue spreader. Get a dab of epoxy on the tip of the spreader and spread it on the glue plate. Do not press down very hard or else it will spread out on the chips to much.

Now slowly lower the jig on the hybrid panel (again lining up 'T' over 'T'). Lower it evenly and once it is all the way down place the weight on top of the jig and let it solidify for 24 hours.

<-- Image of weight on jig -->

Gluing the Module

Take the base plate for the sensor plate and place the sensor on it (on top of the piece of paper to spread the suction). The strips should be running parallel to the metal supports along the sides. Line the sensor up so the it is touching both of the metal pins, then turn on the vacuum.

<-- image of sensor on base plate -->

Check that the jig can be lowered down all the way on this base plate (again line up 'T' over 'T'). Now with the vacuum to the hybrid panel turned on cut the connectors from the hybrid to the panel.

<-- Image of connectors from hybrid to panel -->

Lower the jig on the hybrid panel, turn off the vacuum to the hybrid and turn on the vacuum to the jig. Now slowly lift up the hybrid and lower the hybrid glue plate onto the jig.

<-- Image of hybrid glue plate on jig -->

Spread the regular epoxy on this glue plate, again do not push too hard or else it will seep out along the edges. Now with the epoxy on the hybrid slowly lower it down onto the sensor plate and place the weight on top of the jig. Again wait 24 hours for the glue to harden.

  -- Tom-Erik Haugen - 2016-11-29

Revision 12016-11-29 - TomErikHaugen

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Thermomechanical modules (TM)

The Hybrids come on a hybrid panel, for the TM modules there are version 1.1 and 1.2 hybrids (1.2 are wider where the HCC is).

<-- Image of Panel -->

This panel is screwed onto a base plate

-- Tom-Erik Haugen - 2016-11-29

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