Difference: ThermoMechanical (2 vs. 3)

Revision 32017-04-10 - TomErikHaugen

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META TOPICPARENT name="GlueDocumentation"

Thermomechanical modules (TM)

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  Important rule for this entire process: Most of the pieces are marked with a 'T', this is for alignment. Always place the equipment so that 'T' is over 'T'.
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Mixing the glue

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There are two kinds of glue used. Silver epoxy is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy is in the strips cabinet.
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There are two kinds of glue used. Silver epoxy (Loctite Ablestik 2902) is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy (Epolite 5313A) is in the strips cabinet.
 
<-- image of both epoxies -->
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<-- image of positioning base plate with directions drawn on -->
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Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. One of the jigs is missing the metal support so it is not usable. One fits on the positioning base plate so it should be used for chips to hybrid. One works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.
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Chip_Placement.jpg

Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. Part A of the jigs is missing the metal support so it is not usable. Part A fits on the positioning base plate so it should be used for chips to hybrid. Part B works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.

 
<-- Image of the vacuum jigs including the identifying marks that will be added to this documentation -->
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<-- image of glue plate on jig -->
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Glued_Chips.jpg
 Now get the silver epoxy and the glue spreader. Get a dab of epoxy on the tip of the spreader and spread it on the glue plate. Do not press down very hard or else it will spread out on the chips to much.

Now slowly lower the jig on the hybrid panel (again lining up 'T' over 'T'). Lower it evenly and once it is all the way down place the weight on top of the jig and let it solidify for 24 hours.

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Comments

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META FILEATTACHMENT attachment="Chip_Placement.jpg" attr="" comment="" date="1491840690" name="Chip_Placement.jpg" path="Chip_Placement.jpg" size="4074908" user="TomErikHaugen" version="1"
META FILEATTACHMENT attachment="Chips_on_Jig.jpg" attr="" comment="" date="1491840700" name="Chips_on_Jig.jpg" path="Chips_on_Jig.jpg" size="2990303" user="TomErikHaugen" version="1"
META FILEATTACHMENT attachment="Glued_Chips.jpg" attr="" comment="" date="1491840711" name="Glued_Chips.jpg" path="Glued_Chips.jpg" size="2929772" user="TomErikHaugen" version="1"
META FILEATTACHMENT attachment="Chip_Glue_Overlay.jpg" attr="" comment="" date="1491840732" name="Chip_Glue_Overlay.jpg" path="Chip_Glue_Overlay.jpg" size="3033811" user="TomErikHaugen" version="1"
 
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