Hybrid Seven (First Electrical Hybrid Panel)
This is the seventh hybrid from the
first electrical hybrid panel.
Construction
Hybrid Seven was the first electrical hybrid glued. It had the fewest problems (only needed C7-C12 fixed and RP1 and RP2 orientation fixed).
The capacitors were fixed on Nov 30th by John Joseph.
The resistor arrays were fixed on Dec 1st by John Joseph.
The chips were glued to the hybrid on Dec 2nd. The chips used were ABC 130 A0 chips from lot
AIQ819H, chips 85-105. The wafer test results for this batch are on this page
https://twiki.cern.ch/twiki/bin/view/Atlas/ABC130WaferTest
. This is shown in the following image.
The silver epoxy glue was successfuly spread over the chips.
The glued chips were left over the weekend to dry.
HCC chip 10-5 glued on hybrid 7 on Dec 5th
Wire Bonding
Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (up towards data side, back from sensor side). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.
Power bonds were outside of bond area, wrote program on hybrid 6 then moved it over to hybrid 7. Able to get bonds down, however had to redo multiple that did not stick.
DAQ and Connection
Suggestion from Ashley that only 2 of the padterm pads are needed (padterm being the additional bonds on the 3 ABC130 chips furthest from HCC). Apparently Chip ID is more stable with 2 of these bonds. Removed padterm bond on chip 18 on hybrid 7.
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Tom-Erik Haugen - 2016-12-05
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