Hybrid Seven (First Electrical Hybrid Panel)

This is the seventh hybrid from the first electrical hybrid panel.


Hybrid Seven was the first electrical hybrid glued. It had the fewest problems (only needed C7-C12 fixed and RP1 and RP2 orientation fixed).

The capacitors were fixed on Nov 30th by John Joseph.

The resistor arrays were fixed on Dec 1st by John Joseph.

The chips were glued to the hybrid on Dec 2nd. The chips used were ABC 130 A0 chips from lot AIQ819H, chips 85-105. The wafer test results for this batch are on this page https://twiki.cern.ch/twiki/bin/view/Atlas/ABC130WaferTest. This is shown in the following image.


The silver epoxy glue was successfuly spread over the chips.


The glued chips were left over the weekend to dry.


HCC chip 10-5 glued on hybrid 7 on Dec 5th

Wire Bonding

Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be

-- Tom-Erik Haugen - 2016-12-05


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PNGpng Chip_Numbers.png r1 manage 1104.6 K 2016-12-05 - 18:18 TomErikHaugen  
JPEGjpg Chip_Placement.jpg r1 manage 3979.4 K 2016-12-05 - 18:18 TomErikHaugen  
JPEGjpg Chips_on_Jig.jpg r1 manage 2920.2 K 2016-12-05 - 18:18 TomErikHaugen  
JPEGjpg Glued_Chips.jpg r1 manage 2861.1 K 2016-12-05 - 18:18 TomErikHaugen  
JPEGjpg Hybrid_Seven.jpg r1 manage 4069.0 K 2016-12-05 - 18:18 TomErikHaugen  
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Topic revision: r5 - 2016-12-10 - TomErikHaugen
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