Hybrid Seven (First Electrical Hybrid Panel)

This is the seventh hybrid from the first electrical hybrid panel.

Construction

Hybrid Seven was the first electrical hybrid glued. It had the fewest problems (only needed C7-C12 fixed and RP1 and RP2 orientation fixed).

The capacitors were fixed on Nov 30th by John Joseph.

The resistor arrays were fixed on Dec 1st by John Joseph.

The chips were glued to the hybrid on Dec 2nd. The chips used were ABC 130 A0 chips from lot AIQ819H, chips 85-105. The wafer test results for this batch are on this page https://twiki.cern.ch/twiki/bin/view/Atlas/ABC130WaferTest. This is shown in the following image.

Chip_Numbers.png

The silver epoxy glue was successfuly spread over the chips.

Glued_Chips.jpg

The glued chips were left over the weekend to dry.

Hybrid_Seven.jpg

HCC chip 10-5 glued on hybrid 7 on Dec 5th

Wire Bonding

Started bonding from powere side one chip at a time. Height was different, this side of panel was higher in z. Chips 16-20 were misaligned to be shifted upwards on the hybrid, and back towards the back of the pad (see simplistic diagram). The artwork on the hybrid was not consistent chip to chip, and required more time to adjust bond feet than actually bonding.

Power bonds were outside of bond area, wrote program on hybrid 6 then moved it over to hybrid 7. Able to get bonds down, however had to redo multiple that did not stick.

-- Tom-Erik Haugen - 2016-12-05

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JPEGjpg Chip_Placement.jpg r1 manage 3979.4 K 2016-12-05 - 18:18 TomErikHaugen  
JPEGjpg Chips_on_Jig.jpg r1 manage 2920.2 K 2016-12-05 - 18:18 TomErikHaugen  
JPEGjpg Glued_Chips.jpg r1 manage 2861.1 K 2016-12-05 - 18:18 TomErikHaugen  
JPEGjpg Hybrid_Seven.jpg r1 manage 4069.0 K 2016-12-05 - 18:18 TomErikHaugen  
PNGpng Chip_Numbers.png r1 manage 1104.6 K 2016-12-05 - 18:18 TomErikHaugen  
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Topic revision: r6 - 2017-01-17 - TomErikHaugen
 
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