(r4) FirstElectricalModule < Strips

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---+ First Electrical Module (ABC130)

This module was constructed with [[HybridOne][hybrid one]] and [[ElectricalPrototypeHybridSeven][hybrid seven]].

---++ Construction

Hybrid seven was mounted on May 4th. On May 8th we attempted to mount hybrid one, however we saw that chip 3 had come loose. That chip was replaced, bonded, tested, and then the hybrid was mounted onto the module.

Hybrid seven was bonded to the module on May 10th. While bonding hybrid one on May 12th we found all of the chips on the HCC side were loose. The bonder broke the small amount of glue connection on chips 0-5 (chip 3 had already been replaced).

Metrology was performed using the SmartScope on both hybrids on the sensor. Using 2 points on the corners of the chips and one point on the hybrid between each chip. Fitting the hybrid heights with a polynomial and subtracting that fit from the chip heights we see the following measurements (this was when only one chip had been replaced):

<img alt="Module_Metrology_Replaced_Chip.png" height="266" src="%ATTACHURL%/Module_Metrology_Replaced_Chip.png" title="Module_Metrology_Replaced_Chip.png" width="449" />

The goal for the glue heights is 80 microns. Each glue dot is originally made at 120 microns then squeezed down to 80. This shows hybrid seven was glued well, but that hybrid 1 had some absolute slope that caused the chips on one side to not be pressed down enough. Therefore there was only a small amount of glue contact and that broke over time in handling the hybrid.

Chips 0-5 were all replaced (again chip 3 had been replaced before mounting the hybrid). The chips were bonded to the hybrid and the hybrid was bonded to the test frame. This was so that we could test the hybrid before and after bonding to the module.

---++ Retesting Hybrid 1

The first attempts to connect resulted in not being able to capture the HCC ID. After debugging some we found (with the help of Karol) that the data lines were inverted relative to the DAQload, resulting in the binary signal being inverted. This is shown in the image below

<img alt="Data_Lines.png" height="349" src="%ATTACHURL%/Data_Lines.png" title="Data_Lines.png" width="588" />

After flipping the wire bonds we were able to run all of the tests and get results.

Results:

---++ HV Biasing

The original plan was to follow the wire bond diagram for module construction. After talking with Craig it became clear that we should vary the plan some. To correctly connect the HV we had to do the following steps:
   * Solder a wire on the connector pins to short HVret and LV GND '
   * Connect the four corners with AC connections, then connect one of the inner corners of the hybrid to the bias ring to route the leakage current into the HCC
   * Not connect the HVret on the hybrid to the frame, as R2 creates a lot of noise for the system.
<img alt="Module_Data_Bonds.jpg" height="586" src="%ATTACHURL%/Module_Data_Bonds.jpg" title="Module_Data_Bonds.jpg" width="328" />      <img alt="Module_Power_Bonds.jpg" height="586" src="%ATTACHURL%/Module_Power_Bonds.jpg" title="Module_Power_Bonds.jpg" width="328" />

-- %USERSIG{TomErikHaugen - 2017-06-05}%

---++ Comments

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Attachments

Topic attachments
I	Attachment	History	Action	Size	Date	Who
png	ABC130_Module_Connection.png	r1	manage	2227.4 K	2017-07-21 - 06:34	TomErikHaugen
png	Data_Lines.png	r1	manage	1933.5 K	2017-06-26 - 17:03	TomErikHaugen
jpg	IMG_20170615_184126927_1.jpg	r1	manage	306.3 K	2017-06-26 - 16:59	TomErikHaugen
jpg	IMG_20170615_184207176_1.jpg	r1	manage	307.6 K	2017-06-26 - 16:59	TomErikHaugen
jpg	Module_Data_Bonds.jpg	r1	manage	565.5 K	2017-07-21 - 06:34	TomErikHaugen
png	Module_Metrology_Replaced_Chip.png	r1	manage	72.2 K	2017-06-26 - 17:14	TomErikHaugen
jpg	Module_Power_Bonds.jpg	r1	manage	507.4 K	2017-07-21 - 06:34	TomErikHaugen

Topic revision: r4 - 2017-07-21 - TomErikHaugen

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