Hybrid One (First Electrical Panel)

<insert picture of hybrid>

Construction

Capacitors C7-C12 had to be added on Nov 30th, RP1 and RP2 had to be reoriented on Dec 1st. NTC2 was "tombstone" meaning it had a vertical alignment. This was fixed on Dec 5th.

Hybrid has HCC 10-8. This was placed by Rhonda on Dec 5th, and given thirty minutes in the oven for epoxy to harden before ABC 130 chips glued to hybrid

Hybrid has ABC 130 chips 107,111,113,115,117,119,123,127,129,133 in that order starting from the data side of the hybrid (the side with the HCC). These were glued on Dec 5th 2016 after the HCC had been placed.

Wire Bonding

Hybrid was fully wire bonded on the panel on Dec 6th 2016.

Chip 16 (first chip on HCC side) first chip that was bonded. Rhonda noticed small amount of glue on chip (glue looks clear, not silver-epoxy).

Alignment of chips not perfect. Starting at HCC side of hybrid each chip is more shifter towards power side of hybrid. Wire bonds had to be shifted on the last couple of chips.

4 bonds on HV pad did not stick, and 3 on HVret did not stick. These bonds had to be redone.

Bonder returned message that data lines wire bond destination was outside of bobnd area. After restarting the bonder it completed the bonds.

--USERSIG{TomErikHaugen - 2016-12-08}%

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Topic revision: r3 - 2016-12-09 - TomErikHaugen
 
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