Hybrid One (First Electrical Panel)



Capacitors C7-C12 had to be added on Nov 30th, RP1 and RP2 had to be reoriented on Dec 1st. NTC2 was "tombstone" meaning it had a vertical alignment. This was fixed on Dec 5th.

Hybrid has HCC 10-8. This was placed by Rhonda on Dec 5th, and given thirty minutes in the oven for epoxy to harden before ABC 130 chips glued to hybrid

Hybrid has ABC 130 chips 107,111,113,115,117,119,123,127,129,133 from wafer AIQ8I9H in that order starting from the data side of the hybrid (the side with the HCC). These were glued on Dec 5th 2016 after the HCC had been placed. The previous results of the wafer tests for these chips is recorded in https://twiki.cern.ch/twiki/bin/view/Atlas/ABC130WaferTest.

Wire Bonding

Hybrid was fully wire bonded on the panel on Dec 6th 2016.

Chip 16 (first chip on HCC side) first chip that was bonded. Rhonda noticed small amount of glue on chip (glue looks clear, not silver-epoxy).

Alignment of chips not perfect. Starting at HCC side of hybrid each chip is more shifter towards power side of hybrid. Wire bonds had to be shifted on the last couple of chips.

4 bonds on HV pad did not stick, and 3 on HVret did not stick. These bonds had to be redone.

Bonder returned message that data lines wire bond destination was outside of bobnd area. After restarting the bonder it completed the bonds.

--USERSIG{TomErikHaugen - 2016-12-08}%


Topic attachments
I Attachment History Action Size Date Who Comment
JPEGjpg Bonded_Hybrid_1.jpg r1 manage 3813.2 K 2017-01-17 - 19:26 TomErikHaugen  
Edit | Attach | Watch | Print version | History: r10 | r7 < r6 < r5 < r4 | Backlinks | Raw View | Raw edit | More topic actions...
Topic revision: r5 - 2017-01-17 - TomErikHaugen
  • Edit
  • Attach
This site is powered by the TWiki collaboration platform Powered by PerlCopyright © 2008-2019 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.
Ideas, requests, problems regarding TWiki? Send feedback