Left Handed Daqload

Wire Bonds and Connections

Full wire bond diagrams for the hybrid (HCC and ABC chip) are included in HybridLH_Wirebond_Detail_V6.pdf

All of the connections on the LH board seem to work fine, the HV filter (region on the board where C1,C2,R4-R8 are located has all the correct components).



Mini sensor is wire bonded to ABC chip and glued to the HV pad beneath it. Mini-sensor was not correctly cut and is larger than it is supposed to be (shown below)


Sensor should have a bond connecting it to the HVret pad (the outer metal pad). Instead the HV and HVret are shorted together, causing us to measure much larger than expected currents.

-- Tom-Erik Haugen - 2016-10-11


Topic attachments
I Attachment History Action Size Date Who Comment
PDFpdf HybridLH_Wirebond_Detail_V6.pdf r1 manage 419.4 K 2016-10-11 - 23:59 TomErikHaugen  
JPEGjpg LH_DAQload.jpg r1 manage 49.2 K 2016-10-11 - 23:17 TomErikHaugen  
JPEGjpg LH_mini_sensor.jpg r1 manage 5688.1 K 2016-10-11 - 23:17 TomErikHaugen  
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Topic revision: r1 - 2016-10-12 - TomErikHaugen
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