Thermomechanical modules (TM)

Important rule for this entire process: Most of the pieces are marked with a 'T', this is for alignment. Always place the equipment so that 'T' is over 'T'.

Mixing the glue

There are two kinds of glue used. Silver epoxy is for gluing the chips to the hybrid, regular epoxy glues the hybrid to the base plate. The silver epoxy is in a box in the freezer in the clean room, the regular epoxy is in the strips cabinet.

The epoxy is two liquids, mix the well inside the plastic container then pour out the mixture onto a piece of plastic in the epoxy mixing station. Take the glue spreader and replace the tape on the end. Use this to spread the glue.

The epoxy solidifies over time after it is mixed. Use it within ~15 minutes of mixing it, however allow it ~24 hours to dry. Important note: it will start to solidify once mixed, whether or not it is exposed to air, meaning if it is mixed but still in the plastic tube it came in it will still solidify.

Gluing the hybrid

The Hybrids come on a hybrid panel, for the TM modules there are version 1.1 and 1.2 hybrids (1.2 are wider where the HCC is).

This panel is screwed onto a base plate. Clean the hybrid you plan to glue with ethanol and a Q-tip, and connect the vacuum to the hybrid you plan to glue.

The chips (for TM modules they are glass) are placed one at a time using the vacuum pen in the positioning base plate.

Once these are placed check their alignment under a microscope. Now use the vacuum jig to pick up all of the chips at once. Important note: there are three vacuum jigs but only one works for a given task. One of the jigs is missing the metal support so it is not usable. One fits on the positioning base plate so it should be used for chips to hybrid. One works for the module base plate (not yet mentioned), so it should be used for the hybrid to module step.

Connect the appropriate vacuum jig to the vacuum but do not turn on the vacuum yet. Place the vacuum jig on the positioning base plate with the rotating legs down so that it stands above the chips. Carefully check the alignment and slowly lower the vacuum jig so that it comes down parallel to the plate. Lower until it is all the way down, the four bumps on the jig should be touching the base plate. Turn on the vacuum.

Slowly lift up the vacuum jig and check the alignment of the chips. Lower the glue plate on the jig (the plate with 5 holes for each chip) slowly and evenly.

Now get the silver epoxy and the glue spreader. Get a dab of epoxy on the tip of the spreader and spread it on the glue plate. Do not press down very hard or else it will spread out on the chips to much.

Now slowly lower the jig on the hybrid panel (again lining up 'T' over 'T'). Lower it evenly and once it is all the way down place the weight on top of the jig and let it solidify for 24 hours.

Gluing the Module

Take the base plate for the sensor plate and place the sensor on it (on top of the piece of paper to spread the suction). The strips should be running parallel to the metal supports along the sides. Line the sensor up so the it is touching both of the metal pins, then turn on the vacuum.

Check that the jig can be lowered down all the way on this base plate (again line up 'T' over 'T'). Now with the vacuum to the hybrid panel turned on cut the connectors from the hybrid to the panel.

Lower the jig on the hybrid panel, turn off the vacuum to the hybrid and turn on the vacuum to the jig. Now slowly lift up the hybrid and lower the hybrid glue plate onto the jig.

Spread the regular epoxy on this glue plate, again do not push too hard or else it will seep out along the edges. Now with the epoxy on the hybrid slowly lower it down onto the sensor plate and place the weight on top of the jig. Again wait 24 hours for the glue to harden.

-- Tom-Erik Haugen - 2016-11-29


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Topic revision: r2 - 2016-11-29 - TomErikHaugen
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